. . . . . . A1　Manipulators for Vacuum Rotary Motion Feedthrough for Ultra-High Vacuum Linear Motion Feedthrough for Ultra-High Vacuum 2-axis Rotary Motion Feedthrough for Ultra-High Vacuum XY Manipulator for Ultra-High Vacuum 4-axis Manipulator for Ultra-High Vacuum 6-axis Manipulator for Ultra-High Vacuum Made-to-order manipulators A2　Vacuum flanges CrN Surface-Treated Aluminum Alloy ICF Flange NiP Surface-Treated Aluminum Alloy ICF Flange Copper Alloy ICF Flange ICF Flange Type 6-way Cross and Cube（Aluminum alloy） ICF Flange Type 6-way Cross and Cube for Ultra-High and Extreme-High Vacuum（Copper alloy） Gasket for ICF Flanges （use for Aluminum, copper alloy, stainless steel） Bolts, Nuts and Washers for Mounting Aluminum Flanges A3　Screws and Nuts for Vacuum Screws and Nuts for Ultra-High Vacuum Screws for Medium to Low Vacuum Titanium Screws for Vacuum Regular Titanium Screws Ceramic Screws and Nuts Screws and Nuts with Special Surface Treatment Screws and Nuts Made of Special Materials A4　Vacuum Equipment SMART CLUSTER（Compact waferTransfer System） Extreme-High Vacuum System Vacunm-Baking System A5　Other accessories Viewing Port for Ultra-High Vacuum Barium Fluoride Special Viewing Port CCD Camera "Vacuum Eye"(TM) for Ultra-High Vacuum Ultra-High Vacuum Stage Mineral Insulated Cable for Vacuum Fine Adjustment Positioning Unit for Ultra-High Vacuum Wrenchless Nuts Vacuum Crimp Terminals Shutter Mechanism for Ultra-High Vacuum Reflection High Energy Electron Diffraction Device（RHEED） Concentric Spherical Analyzer Electron Beam Source and Photoelectron Analyzer Vacuum-Readiness Machining Services Vacuum-Baking Services Vacuum Analysis Services Manual XY Slit Automatic XY Slit for Atmosphere Automatic XY Slit for Vacuum XY Slit Mechanism for High Vacuum 4-axis Goniometer for Ultra-High Vacuum 5-axis Goniometer for High Vacuum 6-axis Goniometer for Ultra-High Vacuum Higher Harmonic Elimination Mirror Adjuster In-situ Polarized Light Total Reflection Fluorescent XAFS Instrument Small-Angle dispersion camera Wide-Angle/Small-Angle Concurrent Observation Structure Evaluation Apparatus Tune Measuring Instrument Vacuum Dispersion Chamber Beam Profile Monitor Accelerator Vacuum Beam-Ducts Projection X-ray microscope Gravity Measuring Device Atomic Fountain Standards Instrument Room-Temperature Bonder RHEED Built-in Surface Analysis System Vacuum Environment Test System Manipulator for Electron Microscope Ultra Low Temperature Stage Mirror Manipulator for Laser Beams Aluminum Alloy Chamber Copper Alloy Chamber Stainless Steel Alloy Chamber FED Evaluation Equipment
	E　Made-to-order products Device ■ Room-Temperature Bonder Equipment for Room Temperature Wafer Bonding ■Actual installation : National Institure of Advanced Industrial Science and Technology. Ultra-High Vacuum Multiaxial Stage for Micro Assembly ■Actual installation : Research Center for Advanced Science and Technology, The University of Tokyo/Prof. Suga's office ●Outline ■ The room-temperature wafer bonder allows for batch bonding of microdevices fabricated on a wafer or a directly bonded wafer of heterogeneous materials. It cleans two wafer surfaces in a vacuum chamber using an ion gun to bond them at room temperature. Ready for wafers up to 4 inches, the bonder features high-precision positioning. The Ultra-High Vacuum multiaxial stage for microassembly is used to assemble and mount microdevices chip by chip. Specimens mounted on a high-precision positioning stage can be bonded with high prevision at any position and in any posture.
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